We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
Mark M. Budnik, Arijit Raychowdhury, Aditya Bansal...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
The impact of power supply integrity on a design has become a critical issue, not only for functional verification, but also for performance verification. Traditional analysis has...
Sanjay Pant, David Blaauw, Vladimir Zolotov, Savit...
In this paper, we present an efficient procedure for building a piecewise linear function approximation of the speed function of a processor with hierarchical memory structure. Th...
Artificial neural networks (ANNs) have shown great promise in modeling circuit parameters for computer aided design applications. Leakage currents, which depend on process paramete...
Janakiraman Viraraghavan, Bharadwaj Amrutur, V. Vi...