Efficient representation of images usually leads to improvements in storage efficiency, computational complexity and performance of image processing algorithms. Efficient represe...
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
Ever shrinking device sizes and innovative micro-architectural and circuit design techniques have made it possible to have multi-million transistor systems running at multi-gigahe...
This paper gives an overview of some recent methods useful for local and global shape analysis and for the design of solids. These methods include as new tools for global and loca...
This paper presents a parallelization framework for emerging applications on the future chip multiprocessors (CMPs). With the continuing prevalence of CMP and the number of on-die...