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DAC
2011
ACM
14 years 3 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
DAC
2005
ACM
16 years 4 months ago
A low latency router supporting adaptivity for on-chip interconnects
The increased deployment of System-on-Chip designs has drawn attention to the limitations of on-chip interconnects. As a potential solution to these limitations, Networks-on -Chip...
Jongman Kim, Dongkook Park, Theo Theocharides, Nar...
DAC
2011
ACM
14 years 3 months ago
Fast non-monte-carlo transient noise analysis for high-precision analog/RF circuits by stochastic orthogonal polynomials
Stochastic device noise has become a significant challenge for high-precision analog/RF circuits, and it is particularly difficult to correctly include both white noise and flic...
Fang Gong, Hao Yu, Lei He
ANCS
2009
ACM
15 years 1 months ago
SANS: a scalable architecture for network intrusion prevention with stateful frontend
Inline stateful and deep inspection for intrusion prevention is becoming more challenging due to the increase in both the volume of network traffic and the complexity of the analy...
Fei He, Yaxuan Qi, Yibo Xue, Jun Li
DAC
2006
ACM
16 years 4 months ago
Statistical logic cell delay analysis using a current-based model
A statistical model for the purpose of logic cell timing analysis in the presence of process variations is presented. A new current-based cell delay model is utilized, which can a...
Hanif Fatemi, Shahin Nazarian, Massoud Pedram