Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
The increased deployment of System-on-Chip designs has drawn attention to the limitations of on-chip interconnects. As a potential solution to these limitations, Networks-on -Chip...
Jongman Kim, Dongkook Park, Theo Theocharides, Nar...
Stochastic device noise has become a significant challenge for high-precision analog/RF circuits, and it is particularly difficult to correctly include both white noise and flic...
Inline stateful and deep inspection for intrusion prevention is becoming more challenging due to the increase in both the volume of network traffic and the complexity of the analy...
A statistical model for the purpose of logic cell timing analysis in the presence of process variations is presented. A new current-based cell delay model is utilized, which can a...