397 search results - page 40 / 80 » Computer aided architectural design: Wayfinding complexity a... |
130
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DAC
2010
ACM
15 years 7 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
131
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DAC
2006
ACM
15 years 9 months ago
2006
ACM
We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
132
Voted
DAC
2012
ACM
13 years 5 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
133
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SIGGRAPH
1996
ACM
15 years 7 months ago
1996
ACM
Multiresolution analysis has been proposed as a basic tool supporting compression, progressive transmission, and level-of-detail control of complex meshes in a unified and theoret...
136
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CODES
2006
IEEE
15 years 9 months ago
2006
IEEE
The use of Application Specific Instruction-set Processors (ASIP) is a solution to the problem of increasing complexity in embedded systems design. One of the major challenges in...