Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
The objective of this paper is to extend, in the context of multicore architectures, the concepts of tile algorithms [Buttari et al., 2007] for Cholesky, LU, QR factorizations to t...
Internet service providers face a daunting challenge in provisioning network resources, due to the rapid growth of the Internet and wide fluctuations in the underlying traffic pa...
The advent of strong multi-level partitioners has made topdown min-cut placers a favored choice for modern placer implementations. We examine terminal propagation, an important st...
— The X-architecture is a new integrated-circuit wiring technique in the physical design. Compared with the currently used M-architecture, which uses either horizontal or vertica...