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DATE
2007
IEEE
86views Hardware» more  DATE 2007»
15 years 11 months ago
Thermally robust clocking schemes for 3D integrated circuits
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Ta...
ESCIENCE
2007
IEEE
15 years 11 months ago
A SLA-Oriented Management of Containers for Hosting Stateful Web Services
Service-Oriented Architectures provide integration of interoperability for independent and loosely coupled services. Web services and the associated new standards such as WSRF are...
Christoph Reich, Kris Bubendorfer, Matthias Banhol...
FCCM
2007
IEEE
111views VLSI» more  FCCM 2007»
15 years 11 months ago
A Structural Object Programming Model, Architecture, Chip and Tools for Reconfigurable Computing
A new platform for reconfigurable computing has an object-based programming model, with architecture, silicon and tools designed to faithfully realize this model. The platform is ...
Michael Butts, Anthony Mark Jones, Paul Wasson
ICC
2007
IEEE
200views Communications» more  ICC 2007»
15 years 11 months ago
Joint Resource Allocation and Routing for OFDMA-Based Broadband Wireless Mesh Networks
— In this paper, we investigate joint resource allocation and routing for a wireless mesh network consisting of fixed access points inter-connected through multi-channel wireles...
Kemal Karakayali, Joseph H. Kang, Murali S. Kodial...
ICCCN
2007
IEEE
15 years 11 months ago
Outage Analysis of a University Campus Network
—Understanding outage and failure characteristics of a network is important to assess the availability of the network, determine failure source for trouble-shooting, and identify...
Baek-Young Choi, Sejun Song, George Koffler, Deep ...
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