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ESWA
2008
166views more  ESWA 2008»
15 years 4 months ago
Modular design to support green life-cycle engineering
The severe competition in the market has driven enterprises to produce a wider variety of products to meet consumers' needs. However, frequent variation of product specificat...
Hwai-En Tseng, Chien-Chen Chang, Jia-Diann Li
SEUS
2009
IEEE
15 years 11 months ago
Exploring the Design Space for Network Protocol Stacks on Special-Purpose Embedded Systems
Many special-purpose embedded systems such as automobiles and aircrafts consist of multiple embedded controllers connected through embedded network interconnects. Such network inte...
Hyun-Wook Jin, Junbeom Yoo
ACMDIS
2008
ACM
15 years 6 months ago
TapGlance: designing a unified smartphone interface
The difference between using one mobile phone and another can feel like learning a new language based on our extensive experience designing mobile applications for spatial data na...
Daniel C. Robbins, Bongshin Lee, Roland Fernandez
TNN
2008
88views more  TNN 2008»
15 years 4 months ago
A New Approach to Knowledge-Based Design of Recurrent Neural Networks
Abstract-- A major drawback of artificial neural networks (ANNs) is their black-box character. This is especially true for recurrent neural networks (RNNs) because of their intrica...
Eyal Kolman, Michael Margaliot
ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 2 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang