7189 search results - page 479 / 1438 » Connecting Design with Code |
192
Voted
TCAD
2011
15 years 1 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
138
click to vote
HICSS
2002
IEEE
15 years 11 months ago
2002
IEEE
One trend in day-to-day computing involves moving seamlessly from large powerful workstations to small handheld devices. A second trend is continuous collaboration with colleagues...
178
click to vote
SAINT
2002
IEEE
15 years 11 months ago
2002
IEEE
An IX (Internet eXchange) is a mechanism to interconnect many networks to each other. Currently, an ISP (Internet Service Provider) establishes numerous interconnections to other ...
215
click to vote
ADBIS
2009
Springer
15 years 10 months ago
2009
Springer
Scaling up web applications requires distribution of load across multiple application servers and across multiple database servers. Distributing load across multiple application se...
181
click to vote
JNW
2008
15 years 6 months ago
2008
The rapid growth of IP-based mobile telecommunication technologies in the past few years has revealed situations where not only a single node but an entire network moves and change...