A course on pervasive computing should be structured around key functions throughout a systems development process to cover common underlying concerns throughout science and engin...
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
The evolving concepts of mobile computing, context-awareness, and ambient intelligence are increasingly influencing user's experience of services. Therefore, the goal of this...
Abstract. In this paper, we show through a simple secure symmetric key based protocol design and its implementation the feasibility of secure data collection in a vehicular sensor ...
Harry Gao, Seth Utecht, Fengyuan Xu, Haodong Wang,...
Continuous and discrete components can be integrated in diverse systems including defense, medical, electronic, communication, and automotive applications. Given the heterogeneity...