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» Considerations for the design of exergames
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DAC
2007
ACM
15 years 10 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
VLSI
2010
Springer
14 years 8 months ago
Synchronous elasticization: Considerations for correct implementation and MiniMIPS case study
—Latency insensitivity is a promising design paradigm in the nanometer era since it has potential benefits of increased modularity and robustness to variations. Synchronous elas...
Eliyah Kilada, Shomit Das, Kenneth S. Stevens
ACMDIS
2010
ACM
14 years 10 months ago
Some consideration on the (in)effectiveness of residential energy feedback systems
Energy feedback systems, particularly residential energy feedback systems (REFS), have emerged as a key area for HCI and interaction design. However, we argue that HCI researchers...
James Pierce, Chloe Fan, Derek Lomas, Gabriela Mar...
DAC
2009
ACM
15 years 10 months ago
Double patterning lithography friendly detailed routing with redundant via consideration
In double patterning lithography (DPL), coloring conflict and stitch minimization are the two main challenges. Post layout decomposition algorithm [1] [2]may not be enough to achi...
Kun Yuan, Katrina Lu, David Z. Pan
DAC
2009
ACM
15 years 4 months ago
On-line thermal aware dynamic voltage scaling for energy optimization with frequency/temperature dependency consideration
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
Min Bao, Alexandru Andrei, Petru Eles, Zebo Peng