1617 search results - page 277 / 324 » Constraints in Weighted Averaging |
112
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ISCA
2009
IEEE
15 years 7 months ago
2009
IEEE
Industry has shifted towards multi-core designs as we have hit the memory and power walls. However, single thread performance remains of paramount importance since some applicatio...
112
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ASPDAC
2009
ACM
15 years 7 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
99
Voted
MICRO
2006
IEEE
15 years 6 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
98
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CF
2004
ACM
15 years 5 months ago
2004
ACM
Current instruction fetch policies in SMT processors are oriented towards optimization of overall throughput and/or fairness. However, they provide no control over how individual ...
109
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IPSN
2004
Springer
15 years 5 months ago
2004
Springer
Due to constraints in cost, power, and communication, losses often arise in large sensor networks. The sensor can be modeled as an output of a linear stochastic system with random...