Circuit reliability is affected by various fabrication-time and run-time effects. Fabrication-induced process variation has significant impact on circuit performance and reliabilit...
Yinghai Lu, Li Shang, Hai Zhou, Hengliang Zhu, Fan...
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...
Shukri J. Souri, Kaustav Banerjee, Amit Mehrotra, ...
As minimum feature sizes continue to shrink, patterned features have become significantly smaller than the wavelength of light used in optical lithography. As a result, the requir...
Puneet Gupta, Andrew B. Kahng, Dennis Sylvester, J...
As a prevalent constraint, sharp slew rate is often required in circuit design which causes a huge demand for buffering resources. This problem requires ultra-fast buffering techn...
Shiyan Hu, Charles J. Alpert, Jiang Hu, Shrirang K...