The complexity of today’s embedded applications requires modern high-performance embedded System-on-Chip (SoC) platforms to be multiprocessor architectures. Advances in FPGA tec...
Abstract—With the increasing scaling of manufacturing technology, process variation is a phenomenon that has become more prevalent. As a result, in the context of Chip Multiproce...
Shengyan Hong, Sri Hari Krishna Narayanan, Mahmut ...
Abstract—Execution of applications on upcoming highperformance computing (HPC) systems introduces a variety of new challenges and amplifies many existing ones. These systems will...
Avneesh Pant, Hassan Jafri, Volodymyr V. Kindraten...
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...