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EURODAC
1995
IEEE
148views VHDL» more  EURODAC 1995»
15 years 1 months ago
Software system for semiconductor devices, monolith and hybrid ICs thermal analysis
A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC's, multi-chip modules (MCM) and hybrid IC's is presented. For each desig...
Konstantin O. Petrosjanc, I. A. Kharitonov, N. I. ...
ICSE
2007
IEEE-ACM
15 years 3 months ago
Agility and Experimentation: Practical Techniques for Resolving Architectural Tradeoffs
This paper outlines our experiences with making architectural tradeoffs between performance, availability, security, and usability, in light of stringent cost and time-to-market c...
T. C. Nicholas Graham, Rick Kazman, Chris Walmsley
76
Voted
AGILEDC
2006
IEEE
15 years 3 months ago
Reflections on Reflection in Agile Software Development
This paper analyzes the reflections of an agile team, developing a large-scale project in an industry setting. The team uses an Iteration Summary Meeting practice, which includes ...
David Talby, Orit Hazzan, Yael Dubinsky, Arie Kere...
SPE
2010
167views more  SPE 2010»
14 years 8 months ago
Comparing practices for reuse in integration-oriented software product lines and large open source software projects
Abstract. This paper compares organization and practices for software reuse in integrationoriented software product lines and open source software projects. The main observation is...
Jilles van Gurp, Christian Prehofer, Jan Bosch
ESEM
2009
ACM
15 years 4 months ago
Quality models in practice: A preliminary analysis
This paper presents the findings of a survey on quality models in practice conducted among four software companies in Germany. In the first phase of the study, 25 quality manage...
Stefan Wagner, Klaus Lochmann, Sebastian Winter, A...