A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC's, multi-chip modules (MCM) and hybrid IC's is presented. For each desig...
Konstantin O. Petrosjanc, I. A. Kharitonov, N. I. ...
This paper outlines our experiences with making architectural tradeoffs between performance, availability, security, and usability, in light of stringent cost and time-to-market c...
T. C. Nicholas Graham, Rick Kazman, Chris Walmsley
This paper analyzes the reflections of an agile team, developing a large-scale project in an industry setting. The team uses an Iteration Summary Meeting practice, which includes ...
David Talby, Orit Hazzan, Yael Dubinsky, Arie Kere...
Abstract. This paper compares organization and practices for software reuse in integrationoriented software product lines and open source software projects. The main observation is...
This paper presents the findings of a survey on quality models in practice conducted among four software companies in Germany. In the first phase of the study, 25 quality manage...
Stefan Wagner, Klaus Lochmann, Sebastian Winter, A...