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3DIC
2009
IEEE
15 years 27 days ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
ISVLSI
2003
IEEE
15 years 2 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
ISCA
2008
IEEE
15 years 4 months ago
2008
IEEE
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
ICCD
2005
IEEE
15 years 6 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
DAC
2006
ACM
15 years 3 months ago
2006
ACM
We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...