As the family of Alpha microprocessors continues to scale into more advanced technologies with very high frequency edge rates and multiple layers of interconnect, the issue of cha...
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
— The worst-case delay/power of function units has been used in traditional high level synthesis to facilitate design space exploration. As technology scales to nanometer regime,...
The ability to account for the growing impacts of multiple process variations in modern technologies is becoming an integral part of nanometer VLSI design. Under the context of ti...