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» Crosstalk analysis in nanometer technologies
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DAC
1999
ACM
15 years 1 months ago
On-Chip Inductance Issues in Multiconductor Systems
As the family of Alpha microprocessors continues to scale into more advanced technologies with very high frequency edge rates and multiple layers of interconnect, the issue of cha...
Shannon V. Morton
DAC
2006
ACM
15 years 10 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
IOLTS
2003
IEEE
133views Hardware» more  IOLTS 2003»
15 years 2 months ago
Power Consumption of Fault Tolerant Codes: the Active Elements
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
DATE
2008
IEEE
116views Hardware» more  DATE 2008»
15 years 4 months ago
A Variation Aware High Level Synthesis Framework
— The worst-case delay/power of function units has been used in traditional high level synthesis to facilitate design space exploration. As technology scales to nanometer regime,...
Feng Wang 0004, Guangyu Sun, Yuan Xie
DAC
2007
ACM
15 years 10 months ago
Fast Second-Order Statistical Static Timing Analysis Using Parameter Dimension Reduction
The ability to account for the growing impacts of multiple process variations in modern technologies is becoming an integral part of nanometer VLSI design. Under the context of ti...
Zhuo Feng, Peng Li, Yaping Zhan