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ASPDAC
2012
ACM
279views Hardware» more  ASPDAC 2012»
13 years 7 months ago
Block-level 3D IC design with through-silicon-via planning
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim
CVPR
2012
IEEE
13 years 2 months ago
Teaching 3D geometry to deformable part models
Current object class recognition systems typically target 2D bounding box localization, encouraged by benchmark data sets, such as Pascal VOC. While this seems suitable for the de...
Bojan Pepik, Michael Stark, Peter V. Gehler, Bernt...
CVPR
2008
IEEE
16 years 1 months ago
Viewpoint-independent object class detection using 3D Feature Maps
This paper presents a 3D approach to multi-view object class detection. Most existing approaches recognize object classes for a particular viewpoint or combine classifiers for a f...
Joerg Liebelt, Cordelia Schmid, Klaus Schertler
GIS
2007
ACM
16 years 25 days ago
High-level web service for 3D building information visualization and analysis
This paper presents an approach to visualize and analyze 3D building information models within virtual 3D city models. Building information models (BIMs) formalize and represent d...
Benjamin Hagedorn, Jürgen Döllner
76
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VRML
2009
ACM
15 years 6 months ago
X3DOM: a DOM-based HTML5/X3D integration model
We present a model that allows to directly integrate X3D nodes into HTML5 DOM content. This model tries to fulfill the promise of the HTML5 specification, which references X3D f...
Johannes Behr, Peter Eschler, Yvonne Jung, Michael...