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ASPDAC
2005
ACM
86views Hardware» more  ASPDAC 2005»
15 years 5 months ago
Thermal-driven multilevel routing for 3-D ICs
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
Jason Cong, Yan Zhang
AVBPA
2005
Springer
350views Biometrics» more  AVBPA 2005»
15 years 5 months ago
Pose Invariant Face Recognition Under Arbitrary Illumination Based on 3D Face Reconstruction
Pose and illumination changes from picture to picture are two main barriers toward full automatic face recognition. In this paper, a novel method to handle both pose and lighting c...
Xiujuan Chai, Laiyun Qing, Shiguang Shan, Xilin Ch...
DAGM
2005
Springer
15 years 5 months ago
3D Surface Reconstruction by Combination of Photopolarimetry and Depth from Defocus
Abstract. In this paper we present a novel image-based 3D surface reconstruction technique that incorporates reflectance, polarisation, and defocus information into a variational ...
Pablo d'Angelo, Christian Wöhler
ISCIS
2005
Springer
15 years 5 months ago
Selection and Extraction of Patch Descriptors for 3D Face Recognition
In 3D face recognition systems, 3D facial shape information plays an important role. 3D face recognizers usually depend on point cloud representation of faces where faces are repre...
Berk Gökberk, Lale Akarun
KI
2005
Springer
15 years 5 months ago
Heuristic-Based Laser Scan Matching for Outdoor 6D SLAM
6D SLAM (Simultaneous Localization and Mapping) or 6D Concurrent Localization and Mapping of mobile robots considers six dimensions for the robot pose, namely, the x, y and z coord...
Andreas Nüchter, Kai Lingemann, Joachim Hertz...