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133
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GLVLSI
2006
IEEE
15 years 10 months ago
2006
IEEE
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
134
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ISCA
2006
IEEE
15 years 10 months ago
2006
IEEE
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
115
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ASPDAC
2006
ACM
15 years 10 months ago
2006
ACM
Abstract— An efficient algorithm for three-dimensional (3D) capacitance extraction on multi-layered and lossy substrate is presented. The new algorithm represents a major improv...
136
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DAC
2006
ACM
15 years 10 months ago
2006
ACM
Until recently, most 3D graphics applications had been regarded as too computationally intensive for devices other than desktop computers and gaming consoles. This notion is rapid...
130
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NPAR
2010
ACM
15 years 9 months ago
2010
ACM
Recent years have witnessed significant advances in 3D brush modeling and simulation in digital paint tools. Compared with traditional 2D brushes, a 3D brush can be both more intu...