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TODS
2002
64views more  TODS 2002»
15 years 4 months ago
Cost models for overlapping and multiversion structures
Yufei Tao, Dimitris Papadias, Jun Zhang
MR
2007
107views Robotics» more  MR 2007»
15 years 4 months ago
Cohesive zone modeling for structural integrity analysis of IC interconnects
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee...