The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated cir...
Device and interconnect fabrics at the nanoscale will have a density of defects and susceptibility to transient faults far exceeding those of current silicon technologies. In this...
Andrey V. Zykov, Elias Mizan, Margarida F. Jacome,...
Location-free boundary recognition is crucial and critical for many fundamental network functionalities in wireless ad hoc and sensor networks. Previous designs, often coarse-grai...
In this paper we present GOAFR, a new geometric ad-hoc routing algorithm combining greedy and face routing. We evaluate this algorithm by both rigorous analysis and comprehensive ...
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...