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ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
15 years 6 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
ICCAD
2003
IEEE
136views Hardware» more  ICCAD 2003»
15 years 6 months ago
Synthesis of Heterogeneous Distributed Architectures for Memory-Intensive Applications
— Memory-intensive applications present unique challenges to an ASIC designer in terms of the choice of memory organization, memory size requirements, bandwidth and access latenc...
Chao Huang, Srivaths Ravi, Anand Raghunathan, Nira...
VLDB
2007
ACM
101views Database» more  VLDB 2007»
15 years 9 months ago
SQLB: A Query Allocation Framework for Autonomous Consumers and Providers
In large-scale distributed information systems, where participants are autonomous and have special interests for some queries, query allocation is a challenge. Much work in this c...
Jorge-Arnulfo Quiané-Ruiz, Patrick Valdurie...
MOBISYS
2003
ACM
15 years 9 months ago
iFlow: Middleware-assisted Rendezvous-based Information Access for Mobile Ad Hoc Applications
Due to node mobility and limitations on bandwidth availability in wireless channels, there exist unique challenges towards achieving efficient and effective information access in ...
Zongpeng Li, Baochun Li, Dongyan Xu, Xin Zhou
DATE
2009
IEEE
155views Hardware» more  DATE 2009»
15 years 4 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...