497 search results - page 86 / 100 » Design Challenges for High Performance Nano-Technology |
EUROSYS
2006
ACM
15 years 6 months ago
2006
ACM
Building content-based search tools for feature-rich data has been a challenging problem because feature-rich data such as audio recordings, digital images, and sensor data are in...
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SIGMOD
2009
ACM
15 years 9 months ago
2009
ACM
In the rank join problem we are given a relational join R1 1 R2 and a function that assigns numeric scores to the join tuples, and the goal is to return the tuples with the highes...
MICRO
2006
IEEE
15 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ASPLOS
2006
ACM
15 years 3 months ago
2006
ACM
The sustained push toward smaller and smaller technology sizes has reached a point where device reliability has moved to the forefront of concerns for next-generation designs. Sil...
GLVLSI
2003
IEEE
15 years 2 months ago
2003
IEEE
The current trends in high performance integrated circuits are towards faster and more powerful circuits in the giga-hertz range and even further. As the more complex Integrated C...