473 search results - page 49 / 95 » Design Methodologies for Noise in Digital Integrated Circuit... |
108
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ICCAD
2009
IEEE
14 years 9 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
107
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ICCD
2005
IEEE
15 years 8 months ago
2005
IEEE
— Since rapid progress has been made in device improvement and integration of small carbon nanotube fieldeffect transistors (CNFETs) circuits, the time has come for developing c...
ICCAD
2008
IEEE
15 years 8 months ago
2008
IEEE
—Hardware Intellectual Property (IP) cores have emerged as an integral part of modern System–on–Chip (SoC) designs. However, IP vendors are facing major challenges to protect...
DATE
2010
IEEE
15 years 4 months ago
2010
IEEE
—Variations of process parameters have an important impact on reliability and yield in deep sub micron IC technologies. One methodology to estimate the influence of these effects...
DAC
2003
ACM
16 years 24 days ago
2003
ACM
The use of Support Vector Machines (SVMs) to represent the performance space of analog circuits is explored. In abstract terms, an analog circuit maps a set of input design parame...