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DAC
2010
ACM
15 years 3 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
DAC
2003
ACM
16 years 24 days ago
Clock-tree power optimization based on RTL clock-gating
As power consumption of the clock tree in modern VLSI designs tends to dominate, measures must be taken to keep it under control. This paper introduces an approach for reducing cl...
Monica Donno, Alessandro Ivaldi, Luca Benini, Enri...
DATE
2003
IEEE
115views Hardware» more  DATE 2003»
15 years 5 months ago
Embedded Software in Digital AM-FM Chipset
The new standard DRM for digital radio broadcast in AM band requires integrated devices for radio receivers at low cost and very low power consumption. A chipset is currently desi...
Michel Sarlotte, Bernard Candaele, J. Quevremont, ...
DAC
2003
ACM
16 years 24 days ago
A low-energy chip-set for wireless intercom
A low power wireless intercom system is designed and implemented. Two fully-operational ASICs, integrating custom and commercial IP, implement the entire digital portion of the pr...
M. Josie Ammer, Michael Sheets, Tufan C. Karalar, ...
DAC
2007
ACM
16 years 25 days ago
Characterization and Estimation of Circuit Reliability Degradation under NBTI using On-Line IDDQ Measurement
Negative bias temperature instability (NBTI) in MOSFETs is one of the major reliability challenges in nano-scale technology. This paper presents an efficient technique to characte...
Kunhyuk Kang, Kee-Jong Kim, Ahmad E. Islam, Muhamm...