Design simplification is becoming necessary to respect the target time-to-market of SoCs, and this goal can be obtained by using predesigned IP-cores. However, their correct inte...
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Several emerging Design-for-Debug (DFD) methodologies are addressing silicon debug by making internal signal values and other data observable. Most of these methodologies require ...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
With increased logic density due to the shift towards Deep Submicron technologies (DSM), FPGAs have become a viable option for implementing large designs. However, most commercial...
Amit Singh, Luca Macchiarulo, Arindam Mukherjee, M...