132 search results - page 9 / 27 » Design Space Issues for Intrinsic Evolvable Hardware |
ASPDAC
2008
ACM
14 years 11 months ago
2008
ACM
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
CF
2004
ACM
15 years 2 months ago
2004
ACM
Current processor and multiprocessor architectures are almost all based on the Von Neumann paradigm. Based on this paradigm, one can build a general-purpose computer using very fe...
DATE
2010
IEEE
15 years 2 months ago
2010
IEEE
—The use of commercial electronic components is increasingly attractive for the space domain. This paper discusses the current degree of use of these components in space avionics...
JILP
2002
14 years 9 months ago
2002
As microprocessor designs continue to evolve, many optimizations reach a point of diminishing returns. We introduce HLS, a hybrid processor simulator which uses statistical models...
ERCIMDL
2000
Springer
15 years 1 months ago
2000
Springer
Segmentation of a colour image composed of different kinds of texture regions can be a hard problem, namely to compute for an exact texture fields and a decision of the optimum num...