150 search results - page 12 / 30 » Design and CAD for 3D integrated circuits |
106
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DAC
2009
ACM
15 years 10 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
DAC
2012
ACM
13 years 6 days ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
105
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DAC
2011
ACM
13 years 9 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
103
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VW
2000
Springer
15 years 1 months ago
2000
Springer
This article describes a 3D biomechanical simulation of a salamander to be used in experiments in computational neuroethology. The physically-based simulation represents the salama...
ISCAS
2005
IEEE
15 years 3 months ago
2005
IEEE
— The 3-D channel routing is a fundamental problem on the physical design of 3-D integrated circuits. The 3-D channel is a 3-D grid G and the terminals are vertices of G located ...