150 search results - page 14 / 30 » Design and CAD for 3D integrated circuits |
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
Core-based system-on-chips (SoCs) fabricated on threedimensional (3D) technology are emerging for better integration capabilities. Effective test architecture design and optimizat...
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
ICCD
2005
IEEE
15 years 6 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
ISCA
2007
IEEE
15 years 4 months ago
2007
IEEE
Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities an...
ASPDAC
2007
ACM
15 years 1 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...