150 search results - page 16 / 30 » Design and CAD for 3D integrated circuits |
ICCAD
2007
IEEE
15 years 6 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
DAC
2007
ACM
15 years 10 months ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
TVLSI
1998
14 years 9 months ago
1998
— Wave-pipelining is a method of high-performance circuit design which implements pipelining in logic without the use of intermediate latches or registers. The combination of hig...
CSCWD
2008
Springer
14 years 11 months ago
2008
Springer
One of the main objectives in engineering departments of large industries is the implementation of integrated information systems to manage their projects' life cycle. EnViro...
GLVLSI
2006
IEEE
15 years 3 months ago
2006
IEEE
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...