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» Design and CAD for 3D integrated circuits
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JETC
2008
127views more  JETC 2008»
14 years 8 months ago
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
Yong Zhan, Sachin S. Sapatnekar
ICCAD
1994
IEEE
92views Hardware» more  ICCAD 1994»
15 years 1 months ago
Synthesis of manufacturable analog circuits
? We describe a synthesis system that takes operating range constraints and inter- and intra- circuit parametric manufacturing variations into account while designing a sized and b...
Tamal Mukherjee, L. Richard Carley, Rob A. Rutenba...
DAC
1999
ACM
15 years 10 months ago
Converting a 64b PowerPC Processor from CMOS Bulk to SOI Technology
A 550MHz 64b PowerPC processor was developed for fabrication in Silicon-On-Insulator (SOI) technology from a processor previously designed and fabricated in bulk CMOS [1]. Both th...
D. Allen, D. Behrends, B. Stanisic
IH
1998
Springer
15 years 2 months ago
Fingerprinting Digital Circuits on Programmable Hardware
Advanced CAD tools and high-density VLSI technologies have combined to create a new market for reusable digital designs. The economic viability of the new core-based design paradig...
John Lach, William H. Mangione-Smith, Miodrag Potk...
CGF
2004
133views more  CGF 2004»
14 years 9 months ago
SMARTPAPER: An Interactive and User Friendly Sketching System
This paper describes an interactive sketching system for 3D design/modeling that diverts from the conventional menu and button interfaces of CAD tools. The system, dubbed SMARTPAP...
Amit Shesh, Baoquan Chen