150 search results - page 18 / 30 » Design and CAD for 3D integrated circuits |
DAC
2011
ACM
13 years 9 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
ICCAD
2007
IEEE
15 years 6 months ago
2007
IEEE
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
ICCD
2005
IEEE
15 years 6 months ago
2005
IEEE
— Since rapid progress has been made in device improvement and integration of small carbon nanotube fieldeffect transistors (CNFETs) circuits, the time has come for developing c...
GLVLSI
2010
IEEE
15 years 2 months ago
2010
IEEE
Graphene nanoribbon tunneling FETs (GNR TFETs) are promising devices for post-CMOS low-power applications because of the low subthreshold swing, high Ion/Ioff, and potential for l...
DAC
2006
ACM
15 years 10 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...