Sciweavers

150 search results - page 26 / 30
» Design and CAD for 3D integrated circuits
Sort
View
DAC
2005
ACM
15 years 10 months ago
Temperature-aware resource allocation and binding in high-level synthesis
Physical phenomena such as temperature have an increasingly important role in performance and reliability of modern process technologies. This trend will only strengthen with futu...
Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Mem...
ISSS
2002
IEEE
148views Hardware» more  ISSS 2002»
15 years 2 months ago
A Case Study of Hardware and Software Synthesis in ForSyDe
ForSyDe (FORmal SYstem DEsign) is a methodology which addresses the design of SoC applications which may contain control as well as data flow dominated parts. Starting with a for...
Ingo Sander, Axel Jantsch, Zhonghai Lu
ISPD
2003
ACM
92views Hardware» more  ISPD 2003»
15 years 3 months ago
Benchmarking for large-scale placement and beyond
Over the last five years the VLSI Placement community achieved great strides in the understanding of placement problems, developed new high-performance algorithms, and achieved i...
Saurabh N. Adya, Mehmet Can Yildiz, Igor L. Markov...
ASAP
2005
IEEE
135views Hardware» more  ASAP 2005»
15 years 3 months ago
Via-Aware Global Routing for Good VLSI Manufacturability and High Yield
CAD tools have become more and more important for integrated circuit (IC) design since a complicated system can be designed into a single chip, called system-on-a-chip (SOC), in w...
Yang Yang, Tong Jing, Xianlong Hong, Yu Hu, Qi Zhu...
FPGA
2006
ACM
155views FPGA» more  FPGA 2006»
15 years 1 months ago
Improvements to technology mapping for LUT-based FPGAs
The paper presents several improvements to state-of-theart in FPGA technology mapping exemplified by a recent advanced technology mapper DAOmap [Chen and Cong, ICCAD `04]. Improve...
Alan Mishchenko, Satrajit Chatterjee, Robert K. Br...