150 search results - page 9 / 30 » Design and CAD for 3D integrated circuits |
DAC
2010
ACM
15 years 1 months ago
2010
ACM
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...
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GLVLSI
2009
IEEE
14 years 7 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
MICRO
2008
IEEE
15 years 4 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
ASPDAC
2005
ACM
15 years 3 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
ASPDAC
2006
ACM
15 years 3 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...