As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
This paper presents a novel placement algorithm for timing optimization based on a new and powerful concept, which we term differential timing analysis. Recognizing that accurate ...
Amit Chowdhary, Karthik Rajagopal, Satish Venkates...
Although the best processor design for executing a specific workload does depend on the characteristics of the workload, it can not be determined without factoring-in the effect o...
In the software industry, designers are forever trying to “improve” their products by adding ever more features to them, producing bloated software systems that are capable of...
An important step in model-based embedded system design consists in mapping functional specifications and their tasks/operations onto execution architectures and their ressources...
Dumitru Potop-Butucaru, Robert de Simone, Yves Sor...