Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
This paper examines a new building block for next-generation networks: SNAPP, or Stateless Network-Authenticated Path Pinning. SNAPP-enabled routers securely embed their routing d...
Abstract. We introduce a concept of self-organizing Hybrid Neurofuzzy Networks (HNFN), a hybrid modeling architecture combining neurofuzzy (NF) and polynomial neural networks(PNN)....
The paper first presents the integration options of what we call the Timing Description Language (TDL) with MathWorks' Simulink tools. Based on the paradigm of logical executi...
While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...