33 search results - page 1 / 7 » Design for manufacturability and reliability for TSV-based 3... |
83
Voted
ASPDAC
2012
ACM
13 years 8 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
ASPDAC
2010
ACM
14 years 10 months ago
2010
ACM
132
Voted
GLVLSI
2009
IEEE
14 years 10 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
106
Voted
DAC
2012
ACM
13 years 2 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
137
Voted
DAC
2011
ACM
14 years 7 days ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...