33 search results - page 3 / 7 » Design for manufacturability and reliability for TSV-based 3... |
ASPDAC
2007
ACM
13 years 10 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
DAC
2012
ACM
11 years 8 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
DAC
2012
ACM
11 years 8 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
ISPD
2012
ACM
12 years 1 months ago
2012
ACM
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
ASPDAC
2007
ACM
13 years 10 months ago
2007
ACM
As IC process geometries scale down to the nanometer territory, the industry faces severe challenges of manufacturing limitations. To guarantee yield and reliability, physical des...