This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
erse approaches at all levels of abstraction starting from the physical level up to the system level. Experience shows that a highlevel method may have a larger impact since the de...
Abstract. We describe a framework for the design of directional derivative kernels for two-dimensional discrete signals in which we optimize a measure of rotation-equivariance in t...
This paper addresses the problem of low-power fanout optimization with multiple threshold voltage inverters. Introducing splitting and merging conversions that preserve delay, pow...