46 search results - page 5 / 10 » Design optimizations for microprocessors at low temperature |
ICCD
2005
IEEE
15 years 8 months ago
2005
IEEE
Designing temperature-aware microarchitectures for microprocessors at new technologies is becoming a critical requirement due to the exponentially increasing on-chip power density...
ISQED
2008
IEEE
15 years 6 months ago
2008
IEEE
In multi-core processors there are several ways to pair a thread to a particular core. These load-balancing techniques result in a quite different power, performance and thermal b...
FTEDA
2008
14 years 11 months ago
2008
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
DATE
2009
IEEE
15 years 6 months ago
2009
IEEE
—Localized heating-up creates thermal hotspots across the chip, with the integer register file ranked as the hottest unit in high-performance microprocessors. In this paper, we ...
ICCAD
2006
IEEE
15 years 5 months ago
2006
IEEE
Traditionally, at early design stages, leakage power is associated with the number of transistors in a design. Hence, intuitively an implementation with minimum resource usage wou...