: A wealth of current research in microengineering aims at fabricating devices of increasing complexity, notably by (self-)assembling elementary components into heterogeneous funct...
Pervasive robotics will require, in a near future, small, light and cheap robots that exhibit complex behaviors. These demands led to the development of the M2-M4 Macaco project -...
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
— The combined MIMO with Adaptive Modulation and Coding (AMC) technology can provide high spectral efficiency and link robustness. Moreover, the diversity-multiplexing tradeoff ...
Layered Manufacturing is a technology that allows physical prototypes of three-dimensional models to be built directly from their digital representation, as a stack of two-dimensi...
Ivaylo Ilinkin, Ravi Janardan, Michiel H. M. Smid,...