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VTS
1999
IEEE
66views Hardware» more  VTS 1999»
15 years 2 months ago
A New Bare Die Test Methodology
1 While multichip module technology has been developed for high performance IC applications, the technology is not widely adopted due to economical reasons. One of the reasons that...
Zao Yang, K.-T. Cheng, K. L. Tai
ICRA
2010
IEEE
135views Robotics» more  ICRA 2010»
14 years 8 months ago
Implicit nonlinear complementarity: A new approach to contact dynamics
— Contact dynamics are commonly formulated as a linear complementarity problem. While this approach is superior to earlier spring-damper models, it can be inaccurate due to pyram...
Emanuel Todorov
ISCI
2010
211views more  ISCI 2010»
14 years 8 months ago
A new heuristic approach for non-convex optimization problems
In this work a new optimization method, called the heuristic Kalman algorithm (HKA), is presented. This new algorithm is proposed as an alternative approach for solving continuous,...
Rosario Toscano, Patrick Lyonnet
BIRTHDAY
2012
Springer
13 years 5 months ago
A Qualitative Security Analysis of a New Class of 3-D Integrated Crypto Co-processors
3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
Jonathan Valamehr, Ted Huffmire, Cynthia E. Irvine...
SIGMOD
2003
ACM
163views Database» more  SIGMOD 2003»
15 years 10 months ago
Multi-Dimensional Clustering: A New Data Layout Scheme in DB2
We describe the design and implementation of a new data layout scheme, called multi-dimensional clustering, in DB2 Universal Database Version 8. Many applications, e.g., OLAP and ...
Sriram Padmanabhan, Bishwaranjan Bhattacharjee, Ti...