5866 search results - page 1037 / 1174 » Designing Accelerator-Based Distributed Systems for High Per... |
116
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MICRO
2006
IEEE
15 years 9 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
147
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HICSS
2003
IEEE
15 years 8 months ago
2003
IEEE
People need to find, work with, and put together information. Diverse activities, such as scholarly research, comparison shopping, and entertainment involve collecting and connect...
143
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ISPDC
2010
IEEE
15 years 1 months ago
2010
IEEE
—Super-scalar, out-of-order processors that can have tens of read and write requests in the execution window place significant demands on Memory Level Parallelism (MLP). Multi- ...
127
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KDD
2012
ACM
13 years 5 months ago
2012
ACM
Personalization is a ubiquitous phenomenon in our daily online experience. While such technology is critical for helping us combat the overload of information we face, in many cas...
159
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TSE
2010
14 years 10 months ago
2010
Genetic algorithms (GAs) have been applied previously to UML-driven, stress test requirements generation with the aim of increasing chances of discovering faults relating to networ...