7080 search results - page 123 / 1416 » Designing High Integrity Systems Using Aspects |
ICCAD
2006
IEEE
15 years 8 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
ICCS
2004
Springer
15 years 4 months ago
2004
Springer
We propose to use high-level Petri nets as a model for the semantics of high-level parallel systems. This model is known to be useful for the purpose of verification and we show t...
103
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ISCC
2000
IEEE
15 years 3 months ago
2000
IEEE
With a changing structure of networks and application systems due to the requirements of decentralised enterprises and open service markets, distributed systems with rapidly incre...
129
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LCPC
2009
Springer
15 years 3 months ago
2009
Springer
Programming heterogeneous parallel computer systems is notoriously difficult, but MIMD models have proven to be portable across multi-core processors, clusters, and massively paral...
ICRA
2000
IEEE
15 years 3 months ago
2000
IEEE
A robotic system is developed to automate the packing of polycrystalline silicon nuggets into a fragile fused silica crucible in CZ semiconductor wafer production. The highly irre...