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DATE
2010
IEEE
162views Hardware» more  DATE 2010»
16 years 2 days ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
ASPLOS
2012
ACM
14 years 2 months ago
Architecture support for disciplined approximate programming
Disciplined approximate programming lets programmers declare which parts of a program can be computed approximately and consequently at a lower energy cost. The compiler proves st...
Hadi Esmaeilzadeh, Adrian Sampson, Luis Ceze, Doug...
OPODIS
2004
15 years 8 months ago
Embedded Systems - Challenges and Work Directions
Embedded Systems are components integrating software and hardware jointly and specifically designed to provide given functionalities. These components may be used in many different...
Joseph Sifakis
ADC
2003
Springer
123views Database» more  ADC 2003»
16 years 7 days ago
Transactions in Loosely Coupled Distributed Systems
An exciting trend in enterprise computing lies in the integration of applications across an organisation and even between organisations. This allows the provision of services by a...
Alan Fekete, Paul Greenfield, Dean Kuo, Julian Jan...
OWLED
2008
15 years 8 months ago
Managing Change: An Ontology Version Control System
In this paper we present the basic requirements and initial design of a system which manages and facilitates changes to an OWL ontology in a multi-editor environment. This system u...
Timothy Redmond, Michael Smith, Nick Drummond, Tan...