4394 search results - page 235 / 879 » Designing agent chips |
146
click to vote
ICCD
2005
IEEE
16 years 2 months ago
2005
IEEE
Designing temperature-aware microarchitectures for microprocessors at new technologies is becoming a critical requirement due to the exponentially increasing on-chip power density...
168
click to vote
ICCAD
2008
IEEE
16 years 2 months ago
2008
IEEE
Abstract— Process variations make at-speed testing significantly more difficult. They cause subtle delay changes that are distributed rather than the localized nature of a trad...
152
click to vote
ISCAS
2008
IEEE
16 years 11 days ago
2008
IEEE
—We present experimental results from an integrated circuit designed for wireless neural recording applications. The chip, which was fabricated in a 0.6-µm 2P3M BiCMOS process, ...
166
click to vote
VTS
2008
IEEE
16 years 10 days ago
2008
IEEE
— Higher chip densities and the push for higher performance have continued to drive design needs. Transition delay fault testing has become the preferred method for ensuring thes...
100
click to vote
DATE
2007
IEEE
16 years 9 days ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....