4394 search results - page 252 / 879 » Designing agent chips |
301
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ISQED
2011
IEEE
14 years 10 months ago
2011
IEEE
As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability targets. For microprocessors...
153
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HPCA
2006
IEEE
16 years 6 months ago
2006
IEEE
This paper explores the multi-dimensional design space for chip multiprocessors, exploring the inter-related variables of core count, pipeline depth, superscalar width, L2 cache s...
148
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
180
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
—Localized heating-up creates thermal hotspots across the chip, with the integer register file ranked as the hottest unit in high-performance microprocessors. In this paper, we ...
156
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IOLTS
2008
IEEE
16 years 19 days ago
2008
IEEE
— Error correcting coding is the dominant technique to achieve acceptable soft-error rates in memory arrays. In many modern circuits, the number of memory elements in the random ...