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DAC
2008
ACM
15 years 1 months ago
Keeping hot chips cool: are IC thermal problems hot air?
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J...
VLSID
2002
IEEE
159views VLSI» more  VLSID 2002»
16 years 6 days ago
Challenges in the Design of a Scalable Data-Acquisition and Processing System-on-Silicon
Increasing complexity of the functionalities and the resultant growth in number of gates integrated in a chip coupled with shrinking geometries and short cycle time requirements br...
Karanth Shankaranarayana, Soujanna Sarkar, R. Venk...
DAC
2007
ACM
16 years 25 days ago
Chip Multi-Processor Generator
The drive for low-power, high performance computation coupled with the extremely high design costs for ASIC designs, has driven a number of designers to try to create a flexible, ...
Alex Solomatnikov, Amin Firoozshahian, Wajahat Qad...
IAT
2010
IEEE
14 years 9 months ago
Modular JADE Agents Design and Implementation Using ASEME
ASEME is an emerging Agent Oriented Software Engineering (AOSE) methodology. The Model-Driven Engineering (MDE) paradigm encourages software modelers to automate the transition of...
Nikolaos I. Spanoudakis, Pavlos Moraitis
AAMAS
2000
Springer
14 years 11 months ago
The Gaia Methodology for Agent-Oriented Analysis and Design
Michael Wooldridge, Nicholas R. Jennings, David Ki...