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138
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DAC
2010
ACM
15 years 9 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
137
Voted
CASES
2006
ACM
15 years 9 months ago
2006
ACM
Technology scaling trends have forced designers to consider alternatives to deeply pipelining aggressive cores with large amounts of performance accelerating hardware. One alterna...
160
Voted
DSN
2004
IEEE
15 years 9 months ago
2004
IEEE
Advanced molecular nanotechnology devices are expected to have exceedingly high transient fault rates and large numbers of inherent device defects compared to conventional CMOS de...
143
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CF
2006
ACM
15 years 9 months ago
2006
ACM
The slowing pace of commodity microprocessor performance improvements combined with ever-increasing chip power demands has become of utmost concern to computational scientists. As...
144
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ASPDAC
1995
ACM
15 years 8 months ago
1995
ACM
- In this paper, we present a new scheduling algorithms that generates area-efficient register transfer level datapaths with multiport memories. The proposed scheduling algorithm a...