4394 search results - page 742 / 879 » Designing agent chips |
157
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VLSID
2001
IEEE
16 years 5 months ago
2001
IEEE
In this paper, we propose a new transparent built-in self-test ( TBIST ) method to test multiple embedded memory arrays with various sizes in parallel. First, a new transparent tes...
174
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HPCA
2008
IEEE
16 years 5 months ago
2008
IEEE
Interconnection networks-on-chip (NOCs) are rapidly replacing other forms of interconnect in chip multiprocessors and system-on-chip designs. Existing interconnection networks use...
144
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HPCA
2003
IEEE
16 years 5 months ago
2003
IEEE
Java-based middleware, and application servers in particular, are rapidly gaining importance as a new class of workload for commercial multiprocessor servers. SPEC has recognized ...
139
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ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
Abstract— As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit performance. Compared to gate delays, wires are becoming increasing...
140
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ICCAD
2007
IEEE
16 years 1 months ago
2007
IEEE
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...